According to reports issued by the Korean website Pulse News About concluding a strategic partnership in the field of artificial intelligence between two giants in the electronic chip industry, TSMC and SK Hynix.
According to reports, this partnership will focus on developing next-generation best-in-class High Bandwidth Memory (HBM4), a special type of memory used in high-performance computing devices including AI processors.
It is expected that it will be used first in the advanced B100 graphics processing unit based on the Blackwell architecture, on which NVIDIA has high hopes, thanks to NVIDIA’s reliance on the Chiplet design. AMD also plans to use HBM4 memory to unveil its next-generation Instinct GPU in 2025.
This partnership comes after both companies TSMC and SK Hynix considered Samsung a threat to their interests in the market. In this strategic cooperation, both companies seek to strengthen their presence in the rapidly growing artificial intelligence market, which is witnessing increasing interest from major global technology companies.
It is said that this strategic partnership will have a positive impact on the development of HBM4 memory, given that TSMC has significant experience in manufacturing semiconductors, and SK Hynix was able to develop HBM3 and HBM3e memory quickly and with mass production volume.
With the combined efforts of these two companies in the field of developing customized products for artificial intelligence within one team, this partnership is expected to enhance their competitiveness in the artificial intelligence market.
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