Some time ago, Steve Hemmerstoffer, the owner of the Twitter account @Onleaks, shared a CAD rendering of Huawei’s flagship smartphone, the Huawei P50 Pro. Now, he is back to sharing information that is no less interesting. Yes! Steve shared the render and specifications of the vanilla Huawei P50 variant.
We can see that the CAD rendering of the Huawei P50 Steve shared is very clear. The smartphone has a rear camera layout which is also in the form of a pill, just like the Huawei P50 Pro sibling. It stands out and there is a large cut on the inside.
Unlike the Pro variant, Huawei will immerse a flat screen in the Huawei P50 variant. Like the Huawei P50 Pro CAD rendering that Steve shared some time ago, the smartphone is expected to use a curved screen on the sides.
The Huawei P50 is said to come with a glass back panel and metallic frame, just like the Pro variant. This smartphone will likely measure 156.7 x 74 mm. Then, what about the thickness? The P50 will have a thickness of 10.6 mm, including the rear camera layout which will increase to 2.3 mm.
If Steve’s rendering is accurate, the non-Pro variant will be 0.3mm more (with the camera bump) thicker than the Huawei P50 Pro. The Silver color variant shown in the render has Type-C, speakers, antenna line at the bottom, other speakers and an IR blaster on top, volume and power buttons on the right.
As for the specifications, Steve said that the Huawei P50 will come with a 6.3-inch flat screen and has a punch-hole in the top center. The screen has a slightly larger bezel than the ‘Pro’ variant. While we don’t yet know the number of sensors in the camera layout, Huawei is expected to include a Sony IMX800 sensor.
Steve also wrote that the Huawei P50 series will arrive with the flagship Kirin 9000 chipset. Another specification that is expected to be loaded into this smartphone is an in-screen fingerprint scanner and runs with HarmonyOS. Let’s wait for more leaks due to the circulating speculation that the launch will be held April 17th.
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