Sony could not back down from any effort to ensure optimal cooling of its next home console.
The main drawback of the PlayStation 4 will undoubtedly remain its ultra-noisy side because of its high-speed rotating fans in an attempt to cool the internal system. Often mocked for this reason, Sony may well have learned the lessons of its mistakes when designing the PlayStation 5.
While the machine of the Japanese manufacturer has an extraordinary size to ensure perfect cooling of its entrails, we are discovering today that another solution could also be involved. Sony recently filed a patent to use the solution under the name of Metal Liquide for the design of its machine.
@GamersNexus hey Steve, thought you would find this interesting. Looks like Sony wants to use liquid metal on the PS5, complete with a barrier to protect nearby components and deal with mechanical tolerances https://t.co/E7y5EZb27B
— Chris Jenkins (@anexanhume) August 14, 2020
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Although this marketing term makes more than one player dream, in fact it is neither more nor less a new thermal paste answering the name of Eutectic Liquid Metal which should allow a better management of the heat transfer. Taking advantage of an insulating surface, this thermal paste should prevent the heat from certain elements of the console from going to contaminate other components and thus prevent the heat from dissipating unexpectedly throughout the system.
You will understand, if this solution is really applied for the PlayStation 5, the machine should be much quieter, because it will not need to constantly cool its structure.
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