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Intel is stuck in the development of a 10nm process and is now preparing to use its (formerly known) 7nm process from about 2023, when the competition already wants to have its 3nm processes on the market. This is so clear about how the new labels will be perceived by the public and customers, as the most advanced version of the 10nm process (Enhanced SuperFin) has been renamed Intel 7 and the 7nm process is now called Intel 4.
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Intel has thus seemingly decided to completely “erase” the nanometers in the future, which it will talk about, if only in the case of describing the size of its transistors, although it will still be discussed. The Intel 7 process is just as up-to-date as the best version of the 10nm process class, and then Intel 4 will emerge, which should “take full advantage” of EUV lithography. The question is what this means and whether the EUVL will actually be used at all levels, which is very questionable. At the same time, Meteor Lake processors were confirmed, with which Intel will replace the still upcoming Alder Lake and Raptor Lake, as well as Granite Rapids server chips.
Then, for the second half of 2023, the Intel 3 process is planned, which we can see as an improved version of the 7nm Intel 4. Given the reported better conductivity properties, it can be assumed that Intel may use new materials, which will contribute to an 18% increase power per watt. In addition, the EUVL will be used even more, but in the case of Intel 4 it should have been “fully deployed”, so the information is very unclear in this regard.
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Then comes the Intel 20A process, where the letter A means angstrom, as is usually called a tenth of a nanometer. Intel is preparing it for the first half of 2024, or has announced “breakthrough innovations” for this period, so it will probably not be about production with 20A and it would be too early for it after the Intel 3 process. But we’ll see, Intel itself promises that the 20A will see real deployment by the end of 2024.
Intel 20A will also mean the deployment of two new technologies, namely PowerVia and RibbonFET, which we will look at today. PowerVia is especially interesting.
In addition, Intel’s roadmaps end with the 20A process, but we also know that the 18A and the first deployment of improved machines for extreme ultraviolet lithography are to follow.
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