Next-generation fan-out packaging by Samsung Electronics using new substrate technology
Presentation at the ‘Advanced Semiconductor Package Conference’ hosted by THE ELEC Accelerate the development of advanced packaging technologies such as fan-out and 3D “Preparing to apply a new method for next-generation fan-out packaging” Samsung Electronics team leader Lee Chung-seon is giving a presentation at the ‘2023 Advanced Semiconductor Package Innovation Process Conference’. Samsung Electronics introduces … Read more