Sony recently made a nice update to its PS5 console with a new variant known as the CFI-1202 that offers lower temperature and power. The new console is lighter, operates at lower temperatures, and consumes less power, all thanks to an updated AMD Obreon Plus SOC that pays homage to the 6nm TSMC process node.
Sony’s “CFI-1202” PS5 console variant features AMD Oberon Plus 6nm SOC technology: smaller nut size, less power and coolant operation
in recently tearing The video was posted by Austin Evans, Techtuber noted that the Sony PS5 controller was released in a new lighter, cooler and less power hungry variant. This new PS5 variant was named “CFI-1202” and we can now understand why it is better than Sony’s original PS5 variants (CFI-1000 / CFI-1001).
https://www.youtube.com/watch؟v=21vJ9XBozeI
technology outlet, AngstronomyIn its exclusivity, it has confirmed that the Sony PS5 (CFI-1202) is equipped with an advanced AMD Oberon SOC known as the Oberon Plus which uses the TSMC N6 (6 nm) process. TSMC made their 7nm process node (N7) a design rule compatible with the 6nm EUV (N6) node. This allows TSMC partners to easily migrate existing 7nm chips to the 6nm node without incurring major complications. The N6 processing node provides an 18.8% increase in transistor density and reduces power consumption, which in turn lowers temperatures.
This is why the new Sony PS5 consoles are lighter and have a smaller heat sink than the various playback variants. But that’s not all, we can also see a shot of a brand new AMD Oberon Plus SOC chip sitting next to the 7nm Oberon SOC. The new nut size is approximately 260 mm 2, which represents a 15% reduction over the 7 nm SOC operon (~ 300 mm 2). Another advantage of switching to 6nm is the number of chips that can be produced on a single chip. The outlet reported that each SOC Oberon Plus chip could produce about 20% more chips at the same cost.
This means that without impacting the cost, Sony can offer more Oberon Plus chips for use in the PS5 and this could reduce the market shortage that current consoles have faced since their launch. It is also reported that TSMC will phase out 7nm Oberon SOCs in the future and switch entirely to 6nm Oberon Plus SOCs, achieving 50% more chip-by-chip. Microsoft is also expected to use a 6nm process node for its upgraded Arden SOC in the future for its Xbox Series X consoles.
news source: Angstronomy
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