2023.11.16
SoC manufacturers for Android smartphones are Qualcomm and Mediatek.
Speaking of rival next-generation high-end chipsets, the already announced Snapdragon 8 Gen 3 and Dimensity 9300.
And this time, new information about SoCs for upper-middle machines from both companies, one rank below them, has been leaked.
According to GIZMOCHINA as information from a famous leaker,Snapdragon 7 Gen 3 and Dimensity 8300 to be announced within 2 weeksThat’s what he said.
However, it looks like the SD7Gen3 will come first, followed by the Dimensity 8300.
By the way, some benchmark scores attributed to the Snapdragon 7 Gen 3 chip were leaked a while ago.
Also, this SD7Gen3 is expected to be installed in Honor 100, Vivo S18, Vivo V30, OnePlus Ace 3, etc., while Dimensity 8300 is currently likely to be adopted in Redmi K70e. That’s it.
Snapdragon 7 Gen 3 has a CPU core consisting of a 2.63GHz primary child core, 3×2.40GHz high-performance cores, and 4×1.80GHz efficiency cores. And the GPU will be equipped with Adreno 720 GPU.
The Dimensity 8300 chipset, on the other hand, has one Cortex-X3 super-large core clocked at 2.8GHz, three Cortex-A715 performance cores clocked at 2.4GHz, and four Cortex-A510 efficiency cores clocked at 1.6GHz. In terms of graphics, the Dimensity 8300 is said to be equipped with a G520 MC6 GPU with a frequency of 850MHz.
Therefore, just looking at this,Dimensity 8300 seems to have much higher performance than SD7Gen3is.
sauce:GSMArena
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