South Korea’s SK Hynix currently has the most advanced production of NAND memories. In June, it started the production of 238-layer chips, so it is just ahead of Samsung and WD/Kioxia. At the Flash Memory Summit event with Santa Clara, California presented successor prototype.
The sample of the new NAND chip had 321 layers, making it the first ever manufacturer to exceed three hundred. But it will be a long way from prototype to serial production. The company expects to start production only in the first half of 2025.
SK Hynix is not giving too many details yet. The presented TLC-type chip had a total capacity of 1 Tb (128 GB) and, according to the manufacturer, has “59% higher productivity” than the current 238-layer 512 Gb models. But we don’t know what they mean by productivity.
But with each next generation of chips, capacities and speeds increase, while at the same time the price decreases. Today, 2TB SSDs are the most advantageous in terms of price/capacity, in the future this will shift to 4TB models.
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The company also revealed at the Flash Memory Summit that it is expanding production of the fastest NAND for the PCIe 5.0 interface used in computers and UFS 4.0, which is slowly making its way to mobile and tablets. However, SK Hynix has already started the development of PCIe 6.0 and UFS 5.0 successors. But the latter does not even have final specifications yet.
2023-08-11 12:53:57
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