Jakarta, Gizmologi – Honor has officially revealed, its latest smartphone that carries a folding screen design. The flagship smartphone named Honor Magic V will be the first device to carry an on-a-chip (SoC) system from Qualcomm Snapdragon 8 Gen 1.
Through its official Twitter account, Honor shared a clip that shows a glimpse of the hinge with the phone open, and the flat edges. Even so, Honor did not provide further information about the specifications and launch date of the Magic V.
quote GSM Arena, said that this smartphone will be supported by Qualcomm’s latest processor chipset, Snapdragon 8 Gen 1. Honor also hinted that it will debut this device in the Chinese market in 2022.
Honor Magic V . Specifications
Unfold all the potential. This is HONOR’s first foldable flagship phone, the #HONORMagicV. pic.twitter.com/Evx1mCOknX
– HONOR (@Honorglobal) December 23, 2021
Rumors are circulating that the Honor Magic V will have an 8.03-inch main screen with ultra-thin glass and a 6.45-inch external screen. The composition of this design is similar to its competitor Samsung Galaxy Z Fold 3
This design is also used by Huawei, which is the former parent company of Honor, in the Mate X2 folding screen phone. But after Honor becomes an independent brand, it is unknown whether there will be any resemblance between the two.
Also Read: Honor X30 Released with Snapdragon 695 Chip, Price IDR 3 Million
Other rumors say that this Honor foldable smartphone will use panels made by BOE and Visionox. Honor Magic V is said to have a launch price of 10,000 yuan (Rp 22.4 million).
Honor Magic V will be a new competitor that competes quite tightly in the foldable smartphone market. Where previously this market was dominated by Samsung and Huawei, but in the last year there have been folding screen phones made by Xiaomi and Oppo that launched in China.
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