Jakarta, Selular.ID – X9 Pro, the latest smartphone from Realme, is reportedly ready to launch in the Chinese market, with the Dimensity 1200 processor, MediaTek’s most powerful mobile chipset.
The existence of this cellphone, uploaded on Weibo by reliable leakers by distributing photos which are claimed to be the Realme X9 Pro Master Edition, by again partnering with Naoto Fukasawa to design their latest cellphone. This collaboration has been established for the second time on the previous master edition cellphone, namely the X2 Pro Master Edition 2019.
Also read: Realme 8 Series Launching Soon!
For the Realme X9 Pro Master Edition, the manufacturer uses the same layer of material used for the 2019 Realme X2 Pro Master Edition variant. This device has a curved screen, and carries a punch hole model with a hole in the top left corner for the selfie camera. The screen measures 6.55 inches and has a refresh rate of 90Hz.
Then in the camera sector there are three lenses on the back of the phone and all of them are stacked vertically in a black housing along with an LED flash.
Under the back panel is a 4500mAh battery that supports 65W fast charging. The leak also reveals that the phone has a plastic frame which is 7.8 millimeters thick.
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For the record, the X9 Pro seems to be the second, from the Realme smartphone product that carries the Dimensity 1200.The other is the Realme GT Neo which was introduced at the launch of the Realme GT earlier this month.
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