Realme X9 Pro is a new smartphone from Realm which is expected to launch in China soon. This smartphone is one of the first devices to be powered by the most powerful mobile chipset of the MediaTek Dimension 1200.
While waiting for its release date, photos of the X9 Pro Empire Special Edition have been posted on the Internet. The photos, which are reported to be RealMe X9 Pro Master Edition, were leaked on Weibo by a whistleblower who goes by the nickname “WHYLAB”.
WHYLAB has announced that RealMe will again collaborate with Naoto Fukusawa to design smartphones. As we already know, Fukusawa is the same designer who worked with RealMe on the Master Editon smartphone.
As for the RealMe X9 Pro Master version, the manufacturer uses the same “cement” coating used for the 2019 version of the RealMe X2 Pro Master. The screen is 6.55 inches and has a 90Hz refresh rate.
On the back of the device are three cameras, all stacked vertically in a black housing, as well as a tablet-shaped LED flash. Underneath the gray back panel is a 4,500 mAh battery, and the device is said to support 65W faster charging.
Leaked photos shared by WHYLAB also reveal that the smartphone has a plastic frame and is 7.8 millimeters thick. Unfortunately, there has been no confirmation from Realm regarding the screen board used. However, the X9 Pro Empire is expected to use an AMOLED display panel.
The X9 Pro dimensions appear to be the second of the two royal devices powered by 1200. Another smartphone is the royal GT Neo, which revealed some specifications earlier this month when it launched the GT G, which is powered by Snapdragon 888. It is not yet known which of the two devices will be announced. first.
–
