realme X9 Pro is a new smartphone from Realme which is expected to launch in China soon. The smartphone will be one of the first devices to be powered by the Dimensity 1200, MediaTek’s most powerful mobile chipset.
While waiting for the launch date, photos of the X9 Pro realm special edition have been posted on the internet. Photos reported as realme X9 Pro Master Edition were posted on Weibo by a leaker who goes by the nickname “WHYLAB”.
According to WHYLAB, Realme will collaborate with Naoto Fukasawa again to design the smartphone. As we already know, Fukusawa is the same designer who has worked with Realme on Master Editon smartphones before.
For the realme X9 Pro Master Edition, the manufacturer uses the same “cement” coating used for the realme X2 Pro Master Edition 2019 variant. This device has a curved screen, a first for realme, and has a punch-hole in the top left corner. The screen measures 6.55 inches and has a 90Hz refresh rate.
There are three cameras on the back of the device and all of them are stacked vertically inside a black housing along with a pill-shaped LED flash. Underneath the gray back panel is a 4,500 mAh battery and the device is also said to support 65W fast charging.
Leaked photos shared by WHYLAB also reveal that the smartphone has a plastic frame and is 7.8 millimeters thick. Unfortunately, there has been no confirmation from Realme regarding the screen panel used. However, it is estimated that the X9 Pro realm will use an AMOLED screen panel.
The X9 Pro seems to be the second of the two realm devices powered by Dimensity 1200. Another smartphone is the realm GT Neo, which some of the specifications were revealed at the launch of the realm GT powered by Snapdragon 888 earlier this month. It is not yet known which of the two devices will be announced first.
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