Thursday, 23 November 2023 – 13:30 WIB
Gadget – MediaTek has just announced the Dimensity 8300, a power-efficient chipset designed for 5G smartphones.
As the newest SoC in the Dimensity 8000 line, this chipset combines generative AI capabilities, power saving, adaptive technology and fast connectivity to deliver the best experience in mid-range smartphones.
A mid-range SoC built on TSMC’s 2nd generation 4nm manufacturing process, the Dimensity 8300 has an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm’s latest v9 CPU architecture.
With this powerful core configuration, the Dimensity 8300 offers 20% faster CPU performance and 30% better power efficiency compared to the previous generation chipset.
Additionally, the Dimensity 8300’s Mali-G615 MC6 GPU upgrade delivers up to 60% better performance and 55% better power efficiency.
Generative AI
The MediaTek Dimensity 8300 is the first mid-range SoC to come with full generative AI support, thanks to the AI APU 780 processor integrated into the chipset.
2023-11-23 06:30:00
#MediaTek #Dimensity #Standard #MidRange #Phones
