MediaTek Dimensity 6300 SoC Launched: Faster CPU and GPU Performance, 5G Modem Integrated.

Jakarta –

MediaTek released its latest system on chip (SoC) in the middle class, which is the Dimensity 6300 which succeeds the Dimensity 6100+.

One of the differences compared to the previous one is the faster CPU clock speed. That is, the two main Cortex-A76 cores have a speed of 2.4GHz, up from 2.2GHz. Then six Cortex-A55 cores have a speed of 2GHz.

The Dimensity 6300 is made with TSMC’s 6nm manufacturing and is equipped with a Mali-G57 MC2 GPU. MediaTek claims that this combination produces 10% faster CPU performance and 50% faster GPU performance than the Dimensity 6100+.

This SoC is also equipped with a MediaTek UltraSave 3.0+ feature for power saving and a 5G modem integrated with 3GPP Release 16 standards, as announced by detikINET from GSM Arena, Saturday (19/4/2024).

It also has MediaTek HyperEngine which is promised to extend battery life up to 11% when playing games, 13% more FPS

The RAM chips supported are the same as the previous one, namely LPDDR4x 2,133MHz and UFS 2.2 storage. The highest supported screen resolution is 1080 x 2520 pixels with a maximum refresh rate of 120Hz, and supports the main camera with a resolution of up to 108MP, dual band WiFi 5, and Bluetooth 5.2.

The Realme C65 5G is expected to be the first mobile phone to use the Dimensity 6300, and is expected to be released at the end of this month.

For your information, the Dimensity 6100+ is still widely used in recently released cell phones in Indonesia. For example, the Realme 12 5G and the Samsung Galaxy A15 5G.

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(asj/asj)