Korea-US semiconductor dominance is over… Hanwha provides TC bonds for HBM to SK Hynix for the primary time

Signed contract with Hanwha Precision Equipment for the supply of two TC coupling analysis tools
The supply date is June 10
The competitors to win orders for 12-layer HBM3E connector tools within the second half of the 12 months is a three-way battle between Hanmi and Hanwha and ASMPT.

Hanwha Precision Equipment signed a contract with SK Hynix to produce core tools for prime bandwidth reminiscence (HBM) manufacturing. ASMPT, a Dutch tools firm, additionally agreed to develop new TC coupling tools in response to SK Hynix’s necessities. Competitors within the HBM TC connector tools market is anticipated to extend inside SK Hynix, which is nearly monopolized by Hanmi Semiconductor.

SK Hynix plans to run tools from new corporations comparable to Hanwha on the mass manufacturing line after which place massive orders if the take a look at outcomes are good. Consultants imagine that orders for TC coupling tools for HBM3E with 12-layer stack, which shall be positioned within the second half of this 12 months, are prone to be divided into two or three methods.

In keeping with the business on the thirty first, Hanwha Precision Equipment lately handed an exterior high quality take a look at for TC coupling tools developed along with SK Hynix. As well as, it’s reported that the contract was signed on the situation that two items of TC Hanwha Precision Equipment’s coupling tools shall be obtained on June 10. That tools is for ‘analysis functions’, not ‘for mass manufacturing’. SK Hynix plans to guage a line with this tools by the tip of July.

A enterprise official mentioned, “If that passes, we’ll swap to purchasing analysis tools and we’ll obtain large-scale orders within the second half of the 12 months. This official mentioned, “The manufacturing division of SK Hynix was concerned from the manufacturing stage of Hanwha Precision Equipment’s analysis tools. If it doesn’t cross the analysis, it is going to take time, however the route of duplication and triadization has been set .”

Hanwha Precision Equipment is reportedly assembling further tools at its plant in Changwon, Gyeongsangnam-do in preparation for the tools order.

A part of the method for TC connection tools for HBM3E 12-layer, which is scheduled for giant orders within the second half of the 12 months, together with this tools from Hanwha, shall be modified. Beforehand, bonding tools was used to construct the die of the chip, after which the chip was utterly bonded by way of a mass reflow (MR) course of after which went by way of an underfill course of for insulation.

The 12-layer HBM3E has a thinner wafer die. To forestall warpage, we determined to use some warmth throughout becoming a member of, becoming a member of it collectively, after which going by way of the MR course of. SK Hynix known as this technique hMR (Heated Mass Reflow).

SK Hynix is ​​at the moment evaluating tools from the three corporations: Hanmi Semiconductor, Hanwha Precision Equipment, and ASMPT. Hanmi Semiconductor’s tools is reported to enhance the efficiency of the tools since hMR will not be excellent. It was assessed that productiveness also needs to be elevated. ASMPT tools is evaluated to have a greater high quality of hMR know-how in comparison with Hanmi Semiconductor tools, however there have been feedback that productiveness and tools measurement are massive. ASMPT is reportedly growing its tools to satisfy the wants of SK Hynix.

Relating to Hanwha Precision Equipment’s TC bonding tools, the pattern bonding outcomes have been reported to be higher than these of Hanmi Semiconductor’s tools. The tools shall be delivered in June and additional testing shall be carried out on the precise mass manufacturing line.

SK Hynix plans to buy round 30 items of latest TC connection tools appropriate with hMR know-how within the second half of this 12 months. One other business official mentioned, “The three corporations might have totally different fortunes relying on the take a look at outcomes.”

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