The launch of AirJet Mini Slim will bring better heat dissipation to various thin and light devices and reduce noise, dust accumulation and other problems.
Exhibited in collaboration with Zotac at Computex 2023 last yearAirjet Mini cooling modulethis time launched by Frore Systems during CES 2024, a thinner and lighterAirJet Mini SlimThe design also boasts a more significant cooling effect than traditional fans.
At the same time, AirJet Mini Slim is only 2.5mm thick and weighs only 8 grams. It is thinner and lighter than the AirJet Mini launched last year, and maintains the same heat dissipation performance.
According to Frore Systems, AirJet Mini Slim also uses electricity to drive the vibration of the internal membrane, thereby sucking in outside air and quickly expelling it. In the process, a wind speed of 200 meters per second is generated, thereby driving away the heat around the chip. During operation, there will be no obvious high-speed noise like traditional fans, and it can be used in various thin and light laptops, small PCs, or fanless mobile phones, tablets and other devices, and can even be used in IoT devices and Automotive platform device.
In addition, AirJet Mini Slim also has a thermal sensing function. Once the detected temperature becomes significantly higher, it will automatically increase the heat dissipation efficiency and can be applied to various passive components with heat dissipation requirements, such as SSDs, I/O ports, etc., which also have high heat dissipation requirements. Components that load operating requirements. It also has an automatic cleaning function to avoid dust accumulation after long-term use. Dust can be removed through automatic reverse air blowing, allowing AirJet Mini Slim to maintain normal cooling effects.
In addition to AirJet Mini Slim, Frore Systems announced the first AirJet cooling module in January last year, and announced the thinner and lighter AirJet Mini during Computex 2023 last year. The AirJet Mini Slim launched this time also has the feature of being able to be expanded to multiple groups. A single chip can remove approximately 5W of heat energy, and multiple modules are used to increase the heat dissipation effect.
