At the Intel Technology Tour 2023 MTL Tech Day event, Intel emphasized that it will continue to focus on creation, connectivity, games, and work and study applications in the Client Computing Group (CCG), and emphasized that it has previously announced that it will advance within 4 years. The 5 process node target has been completed and 2 process nodes have been promoted, namely Intel 7 and Intel 4. It is expected to enter the Intel 3 process in the second half of this year, and plans to promote the Intel 20A process in the first half of 2024, and in 2024 The Intel 18A process will be promoted in the second half of the year.
▲Intel will be the first to introduce the Intel 4 process in Meteor Lake
Faced with the fact that TSMC, Samsung and other companies have entered the 3nm process development, Intel, which has been stuck in process technology for a long time, hopes to significantly regain its previous disadvantage in process technology by advancing the goal of five process nodes in four years.
Intel has successfully advanced its process technology to the Intel 4 process in 2022, which is equivalent to TSMC’s 7nm to 5nm process. The Intel 3 process that is expected to be promoted next is approximately equivalent to TSMC’s 5nm to 3nm process, while the Intel 20A process is approximately equivalent to TSMC’s 3nm to 2nm process. , as for the Intel 18A process, it will be compared with TSMC’s 2nm to 1.4nm process.
▲The Intel 3 process that Intel is expected to promote next is approximately equivalent to TSMC’s 5nm to 3nm process, while the Intel 20A process is approximately equivalent to TSMC’s 3nm to 2nm process. As for the Intel 18A process, it will be compared to TSMC’s 2nm to 1.4nm process ▲Compared to the Intel 7 process , Intel 4 process will be able to drive up to 2 times performance improvement
Among them, the Intel 3 process, Intel 20A process and Intel 18A process are currently in the pre-mass production stage, and Intel aims to enable Intel 18A to successfully enter the mass production stage in 2025, and is expected to be used in the next code-named “Lunar Lake”, the same It integrates VPU artificial intelligence computing components and other designed processor products. In addition, it has also confirmed to cooperate with Arm to manufacture Arm’s new architecture design processor using Intel 18A process.
In the next processor product design, Intel said that in response to the increasing demand for artificial intelligence computing in the market, it will highly integrate artificial intelligence computing acceleration components and enhance display computing performance to promote more efficient artificial intelligence computing. At the same time, the computing performance per watt will be greatly improved to meet the needs of more complex artificial intelligence computing.
▲Intel will introduce more artificial intelligence computing applications in its next processor products
Regarding the Intel 4 process used in the 14th generation Core processor code-named Meteor Lake, Intel stated that it will increase the density of high-efficiency computing transistors by 2 times compared to Intel 7, and will use extreme ultraviolet lithography (EUV) technology to achieve smaller process design. Compared with the Intel 7 process, it can also provide more than 20% improvement in power usage efficiency.
At the same time, the introduction of extreme ultraviolet lithography technology can also simplify the process process, which is conducive to mass production and ensures an improvement in production yield. It is also conducive to process design and processor products to have higher power usage, while improving computing performance. At the same time, it can also ensure the efficiency of power usage.
Intel also emphasizes its EMIB packaging technology and Fovero stacking technology to allow the processor to accommodate more transistors, computing components, I/O controllers, etc. in a smaller area, especially in the 14th generation Core processor code-named Meteor Lake. It will be designed with a new Flexible Tiled architecture and use Fovero Advanced stacking technology to connect most key components, allowing the processor to be more effectively reduced and drive higher computing performance with lower power consumption.
▲Meteor Lake will be built with advanced packaging technology ▲Compared with Raptor Lake’s packaging technology, Meteor Lake’s advanced packaging technology will be able to cope with higher transistor density and lower power loss, while also improving the communication and operation efficiency of internal computing components ▲Intel emphasized In addition to continuing to advance process nodes, we also plan to continue advancing in packaging technology to secure our leading position in semiconductors.
