Chinese media reports, Hon Hai (2317-TW) The Group has deployed a high-end semiconductor packaging and testing plant in Qingdao. The main plant has been capped and the main structure has been completed. It is estimated to be put into operation next year and reach the full capacity target by 2025.
It is understood that the relevant project took 176 days from the start of construction to the completion of the main plant structure, laying a good foundation for the installation and commissioning of equipment in 2021, and also achieving signing, landing, starting and capping that year.
Hon Hai Group Qingdao Semiconductor High-end Packaging and Testing Project Total InvestmentRMB 1 billion yuan, according to the plan, will lock the current demand for fast-growing 5G, artificial intelligence and other high-end application chip packaging and testing needs.
Hon Hai’s chairman Liu Yangwei also revealed that the group’s participation in the Malaysian fab bid has a great chance of winning, but future progress will still take time.
Semiconductors were originally one of the focus projects of Hon Hai’s “3+3” transformation, and as the layout of semiconductors continues to advance, the market is optimistic. It will not only improve the semiconductor upstream, midstream and downstream industrial chain, but also help other 3+3 technologies and industries. development of.
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