Socket AM5 means the transition to the LGA interface, it brings support for DDR5. It can be assumed that it also counts on PCIe 5.0 (although the first generation of processors designed for it supports PCIe 4.0) and is equipped for a higher TDP range (up to 170 watts).
The leaked AMD materials both confirm that the processor and socket look as published by leaker Locuza on their renders, and show the pitch of the holes with the same distance ratio as the AM4 socket. Maintaining the dimensions (90 × 54 mm) would most likely mean maintaining compatibility with existing coolers. Although the pitch of the mounting holes is not the only parameter on which it depends, if the others were significantly different, AMD would probably choose a different pitch to prevent the installation of an unsuitable heat sink, which could result in damage.
The table specifying the heatsink requirements confirms that the AM5 socket has a TDP of up to 170 watts. This was supposed to be related to some special edition (but whether it was related to the generation Zen 4 we still do not find out from these documents – previous sources in this respect were not uniform).
Processors with architecture Zen 4 will be manufactured on a 5nm process (core), will bring ~ 20% increase in IPC over Zen 3 and will probably retain 16 cores (24 cores will probably be fitted up to Zen 5). The release is expected by the end of next year.
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