In recent years, in addition to traditional chips such as CPU and GPU, DPU has become the third major chip in the data center, and domestic chip makers are also making continuous efforts in this field.A few days ago, Zhongke Yushu announced that the K2 self-developed second-generation DPU chip, the industry’s first domestic DPU chip to be powered on, has been successfully ignited.
According to the company, K2 adopts a mature 28nm process, which can support network offloading, storage, virtualization and other functions. It is currently the first DPU chip in the form of an ASIC with relatively complete functions in China. Advantage.
Especially in terms of performance,It has extremely excellent latency performance, can achieve ultra-low latency of 1.2 microseconds, and supports up to 200G network bandwidth.
In terms of application scenarios, it can be widely used in financial computing, high-performance computing, data centers, native cloud, 5G edge computing and other scenarios, and is expected to become the domestic DPU chip with application on a large scale faster.
“K2 is Zhongke Yushu’s second-generation DPU product. The successful enlightenment of K2 has laid a solid foundation for the large-scale mass production of DPU chips, and it is a big step for the maturation of Yushu DPU.” Founder of Zhongke Yushu, when CEO Yan Guihai commented on the importance of K2’s lighting, he said that when K2 completed its R&D, it coincided with the country’s strategy of counting from east to west, and was born at the right time.
According to Lu Wenyan, the entire K2 project has undergone more than 60 program reviews, and nearly 400,000 lines of code have been developed on the chip’s front end; DPU is an application-related chip and is required to complete cloud native computing, storage, and financial R&D stage Application prototype adaptation in 5 major scenarios such as , edge computing, etc.; thousands of verification and test cases need to be completed in the functional simulation and test phase.
According to the company’s roadmap, K2 is the second generation DPU chip, and after that there will be K3, which will upgrade the 12nm process, improve the performance of 150TOPS, and support 100Gx4 network bandwidth.In the future, K4 will be upgraded to 7nm process, with improved performance to 600TOPS and support for 200Gx4 network bandwidth.
