[smartPC사랑=이백현 기자] ASRock HDV series is an entry-level product line suitable for productivity work rather than gaming. The mATX motherboard product line released by ASRock is known for being inexpensive and cost-effective, and the ASRock B760M HDVP D5 that we will be reviewing this time is just such a product.
In addition, with B760 taking the position of the most affordable latest motherboard chipset, ASRock B760M HDVP can be said to be a motherboard with a standout price among the entry product lines.
Meanwhile, ASRock B760M HDVP D5 supports various older standards such as D-SUB, DVI-D terminal, and PS/2 keyboard/mouse terminal suitable for office PCs, so it can be connected to office peripherals that have been used for a long time without any problems. Let’s take a closer look at ASRock B760M HDVP D5.
Specifications
CPU Socket – LGA 1700
Chipset – Intel B760
Memory – 2 DDR5 DIMM slots, up to 96GB capacity & 7000MHz clock support, XMP 3.0 support
Graphics output terminal – DP 1.4 x1, HDMI 2.1 x1, DVI-D, D-Sub
Expansion slots – 1 PCIe 5.0 x16 slot, 2 PCIe 4.0 x1 slots, 1 PCI slot
Storage – 2 PCIe 4.0 M.2 SSD slots, 4 SATA3 6Gb/s terminals
Ethernet – 1 x 1Gbps Ethernet
USB – Total of 6 rear (2 USB 3.2 Gen2 Type-A, 3 USB 3.2 Gen1 Type-A, 2 USB 2.0), 6 front (2 USB 3.2 Gen1 Type-A, 4 USB 2.0)
Audio – Realtek 7.1 Channel HD Audio
Operating System – Windows 11, Windows 10 64-bit
Form factor – mATX form factor (24.4×24.4cm)
mATX motherboard suitable for productivity work
ASRock B760M HDVP D5 is a motherboard suitable for productivity tasks with a simple internal structure that excludes decoration. The detachable I/O shield excludes excessive design elements and is suitable for a simple office PC configuration. In addition, the neat silver-colored M.2 and chipset heat sink minimizes system load and increases the stability of productivity work.
Unnecessary design elements were excluded and only functional elements were left.
The silver-colored chipset heatsink relieves chipset load and increases system stability.
The detachable I/O shield also excludes decorative features.
Equipped with 7+1+1 power supply, uses 6-layer PCB
ASRock B760M HDVP D5’s power supply consists of 7+1+1 power phases, and uses a 6-layer PCB instead of the typical 4-layer PCB, providing lower temperatures and higher energy efficiency when attempting memory overclocking.
In addition, ASRock B760M HDVP D5 latest DDR5 memory module supports memory speeds of up to 7000MHz, and Intel XMP technology, an overclocking function that can easily increase memory performance, is also available.
The power phase consists of 7+1+1. It provides two DDR5 memory slots and supports a maximum capacity of 96GB and a speed of 7000MHz.
Two PCIe Gen4 x1 slots plus a PCI slot?
The PCIe slot where the graphics card is mounted is equipped with the latest version, Gen5, so the PCIe Gen5 next-generation graphics card that will be released in the future can be used. Because it uses an SMT type PCIe slot, it improves signal flow and maximizes stability in a high-bandwidth environment compared to existing DIP PCIe slots.
In addition to the main PCIe Gen5 x16 slot, it also provides two PCIe Gen4 x1 slots and a PCI slot, which is a standard prior to PCIe, to maximize expandability and compatibility.
A total of two provided M.2 NVMe SSD slots all support PCIe Gen4, allowing you to maximize the performance of the flagship SSD. Four additional SATA terminals are also provided, allowing for ample storage configuration.
The exterior of the main slot is made of reinforced steel, which ensures signal stability and firmly supports the heavy graphics card. Below that, you can see two PCIe Gen4 x1 slots and a PCI slot.
A total of two PCIe Gen4 M.2 NVMe SSD slots are provided, and a heat sink is installed in the CPU direct lane.
Ample terminals support compatibility with older devices
ASRock’s HDV series is a product line that considers productivity and provides ample and diverse terminal compatibility. A total of 6 USB terminals are supported, including 2 USB 3.2 Gen 1 terminals, 2 USB 3.2 Gen 2 terminals, and 2 USB 2.0 terminals on the back, and a PS/2 standard keyboard and mouse can also be used.
It supports a total of 4 graphic output terminals: D-SUB, DVI-D, HDMI, and DP, so 4 monitors can be used simultaneously without a graphics card.
The rear serial COM terminal (COM1) can also be equipped with industrial devices used in procurement and financial institutions.
Additionally, a serial COM terminal header and a printer terminal header (LPT) are provided internally to allow connection of dedicated printers and equipment, providing a variety of compatibility.
It supports commonly used display output terminals such as HDMI and DP terminals, as well as D-SUB and DVI-D terminals. You can also connect a PS/2 keyboard and mouse. Serial COM terminal header (left) and printer terminal header (right)
In conclusion
ASRock B760M HDVP D5 has the lowest price among Intel 700 series motherboards, while providing a variety of terminals suitable for productivity tasks. The B760 chipset applied to this product is compatible with 3 generations of Intel CPUs, from the previous Intel 12th generation Core processor to the 14th generation Intel Core processor, so it will be a good choice when building an inexpensive office PC.
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