The shortage of microprocessors affects all new technology markets up to car manufacturers. In the United States, the federal government seeks to motivate suppliers to produce directly within the country. Thanks to its partnership and its influence with TSMC, Apple is avoiding problems and is already preparing the next step: a chip engraved in 3 nm, more powerful and economical.
In a recent report by Digitimes, we learn today that this next generation of microprocessors will arrive in mass production in the second half of 2022. Apple has already reserved the exclusivity of the production of these chips engraved in 3 nm, even thinner than the current components engraved in 5 nm (and already exceptionally efficient).
The future 3 nm Apple chips
It is stated that these next chips will provide no less than 15% more power in addition to saving up to 30% energy compared to current microprocessors. Currently, TSMC calls its future 3nm components “N3” technology.
“TSMC has stated that its N3 technology will be the most advanced technology in the world when it begins volume production in the second half of 2022. Building on the proven architecture of FinFET transistors for the best performance, energy efficiency and profitability, N3 will offer up to 15% speed gain and up to 30% lower fuel consumption than the N5 ”.
Should we draw the conclusion that the September 2022 generation of iPhone will be equipped with it? Obviously, no. Apple has just launched 5nm chips, especially on Macs with the new M1 chip (first of the name after the brand’s departure from Intel).
Software integrations and new advanced 5nm technologies of the next iPhone 13 still reserve many improvements before choosing to launch a technology in 3 nm. Likewise, TSMC should provide processors and 4 nm next year especially for the next generation of M chips, for Macs.
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