In early spring, AMD released new server processes, Epycy Milan built on cores Zen 3. All the essential information about this series was known in advance, so it could not and did not surprise. Epyc was expected to be the next big step Genoa with cores Zen 4, which according to the AMD roadmap should be listed by the end of 2022:
Error. At first, the Bondrewd and ExecutableFix leakers had only “funny” allusions in words shortcake or lasagna, which are dishes that contain essentially layers of dough. This was soon followed by a statement from Lisa Su, CEO of AMD, who stated at a conference for JPMorgan that layering and encapsulation of 2.5D / 3D chips are key elements in achieving the next generation performance shift and that more information will be released in the coming months.
Leakers Patrick Schur and ExecutableFix, however, managed to make an hour out of months and immediately announced that AMD will release later this year. Milan-X, a server processor using layered chipsets. Specifically, according to Schur, the classic IO-chiplet should be preserved Genesis and they are to be surrounded by layered chips. Whether the layering should be about processor core chipsets, or the current processor chiplets will be supplemented with any special ones, or it will be about processor core chipsing with some accelerators or memories, no one has yet revealed.
While a few days ago with the release of information that Intel’s Xeony Sapphire Rapids new generation (+ 20% IPC) newer architecture, the situation looked as if AMD should lose some of the lead it had with previous generations of server processors, with information leaked about Milan-X it doesn’t seem so clear anymore.
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