The news announced by AMD at Computex 2021 were not limited to the FidelityFX Super Resolution, and the company showed a new vertical SRAM placement technology in the processor. According to Lisa Su, CEO of the company, this novelty guarantees an increase of 64 MB of cache which, as a result, brings an average of 15% more performance in games.
The development was carried out by AMD in partnership with chip giant TSCM. Together they managed to make use of TSVs (through-silicon-vias), which allow you to stack 64 MB of SRAM on top of the CCD. Even so, the thickness of the processor does not increase, as the presence of silicon can correct the alteration caused by the generated stack.
“We’re taking this Ryzen 5000 processor and stacking a 64MB SRAM at 7nm directly on top of each core complex, effectively tripling the amount of L3 cache powering our Zen 3 cores. The 3D cache plugs directly into the Zen 3 CCD with two silicon lanes transmitting signals and power between stacked chips, supporting bandwidth of more than 2TB per second“, declared Lisa Su.
The CEO also presented a version of the Ryzen 9 5900X equipped with the new technology. For comparison purposes, the company ran a Gears 5 benchmark with two models, one equipped with the 3D cache and the other not. Thus, it was concluded that, in this case, the performance gain was approximately 12%. Without the technology, the average was 184 FPS, while the prototype saw an average of 206 FPS.
According to Lisa Su, the 3D cache should become available later this year. All of AMD’s presentation at Computex 2021 is available at video attached at the beginning of the article. However, if you only want to see the part where the CEO announces the stacking technique, skip the video to 33 minutes.
–
