Much of the teaser material for AMD’s <a href="https://www.world-today-news.com/amd-ryzen-9000x3d-release-date-what-to-expect-from-zen-5-and-new-chiplet-technology/" title="AMD Ryzen 9000X3D Release Date: What to Expect from Zen 5 and New Chiplet Technology”>Ryzen 7 9800X3D featured the keywords “X3D Reimagined”, leaving one wondering what it could be.
A reliable 9550pro hardware source says that AMD has redesigned the way the CPU complex die (CCD) and 3D V-cache die (L3D) are stacked together. In past generations of X3D processors, such as the 5800X3D “Vermeer-X” and 7800X3D “Raphael-X”, L3D was stacked on top of the CCD. It was stacked over the central area of the CCD, which has a built-in 32MB L3 cache, and blocks of silicon structure were placed on top of the edges of the CCD containing the CPU cores, with these silicon structure blocks a ‘ perform the important task of transferring heat from the CPU cores to the IHS above. That is about to change.
If the leaks are correct, AMD has flipped the CCD-L3D stack with the 9000X3D series so that the “Zen 5” CCD is now on top, with the L3D below it, below the center CCD area. CPU cores now dissipate heat in the IHS like they do in regular 9000 series processors without the 3D V-cache technology. They probably achieved this by enlarging the L3D to match the size of the CCD and act as a sort of “base tile”. The L3D had to be covered with TSVs that connect the CCD to the fiberglass substrate below. AMD will probably go far with this in the future. Currently the “base” L3D chip includes 64 MB of 3D V-cache, which is added to the 32 MB of on-chip L3 cache, but in the future (probably with ” Zen 6”) can improve AMD CCD with TSV for even L2 caches per core.
This part of the assumption also perfectly explains what “X3D acceleration” is. With direct CCD communication to the IHS, as is the case in non-X3D processors, X3D processors can have the same overclocking capabilities as standard chips. There are far fewer thermal barriers in the way, and AMD could go ahead and give these chips the same TDP and PPT as regular chips, as well as higher clock speeds. In the past, the company has been conservative with PPT and clock speeds of its X3D processors.
AMD is expected to release the Ryzen 7 9800X3D on November 7, 2024.
