TSMC at the IEDM conference charted a course to ship chip packages with one trillion transistors, much like Intel announced last year. These giants will come with collections of 3D-packaged chiplets on a single package, but TSMC is also working on developing chips with 200 billions of transistors on a single slab of silicon. To achieve this goal, the company confirmed that it is working on 2nm N2-class and N2P-class manufacturing nodes, as well as 1.4nm A14-class and 1nm A10-class manufacturing processes, which should be available by 2030.
In addition, TSMC predicts the development of packaging technologies (CoWoS, InFO, SoIC, etc.) that will allow it to create mass multi-chip solutions containing more than a trillion transistors by approximately 2030.
Development of advanced process technologies has slowed somewhat in recent years as chipmakers face technological and financial challenges. TSMC faces the same challenges as other companies, but the world’s largest foundry is betting that it will be able to improve its production nodes in terms of performance, power and transistor density in the next 5 or 6 years when TSMC releases its 2 -nm, 1.4-nm and 1-nm nodes.
There are now 80 billion transistors Nvidia GH100 one of the most complex monolithic processors on the market, and according to TSMC, even more complex monolithic chips with more than 100 billion transistors are coming soon. But building such large processors is becoming increasingly difficult and expensive, so many companies are opting for multi-chip designs. For example, AMD’s Instinct MI300X and Intel’s Ponte Vecchio consist of dozens of chiplets.
According to TSMC, this trend will continue, and in a few years we will see multi-chip solutions consisting of more than a trillion transistors. But at the same time, monolithic chips will continue to become more complex, leading to monolithic processors with a whopping 200 billion transistors, according to one of TSMC’s IEDM presentations.
TSMC and its customers must develop both logic and packaging technologies simultaneously, with the former providing density improvements for the latter, so the company included both the evolution of manufacturing nodes and packaging technologies in one slide.
2023-12-27 16:39:49
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