Memory factory Winbond (2344-TW) held a Family Day today (28th). General Manager Chen Peiming said that the fourth quarter operations are expected to be slightly better than the third quarter, and he is optimistic about the DRAM market next year. He also revealed that in addition to developing the CUBE product line, he will also expand into advanced packaging. market.
Winbond fired the first shot to reduce production in the memory industry in the fourth quarter of last year, announcing a 40% production cut. However, as demand has improved, the production reduction has been reduced by 20%. Chen Peiming said that shipments will increase in the fourth quarter, prices are expected to be flat or slightly down, and overall operations will not be worse than in the third quarter, and may be slightly better.
Chen Peiming believes that if the terminal demand next year is similar to or unchanged from this year, and there is no inventory in the hands of manufacturers, purchasing power will pick up. It is expected that this will be the case in markets including PCs, notebooks, and mobile phones, and servers will also return. growing up.
Looking at the Flash and DRAM product lines, Chen Peiming said that the DRAM market situation will be better next year. Although the current supply of DDR3 exceeds demand, supply and demand are expected to become more balanced in the second and third quarters, and there may even be shortages.
As for AI layout, Winbond’s CUBE (customized high-bandwidth memory) is expected to enter small-scale production in the second half of 2024 or 2025. Many customers are interested and are jointly conducting trial research and development.
In addition, Winbond will also enter the advanced packaging market, integrating system-on-chip (SoC) with Hybrid bond packaging and its own customized AI DRAM production line, and is expected to enter mass production in 2025. Currently, only Intel, Samsung and TSMC (2330-TW) has some plans in Hybrid bond.
2023-10-28 09:27:15
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