Thermaltake brought an interesting novelty to CES 2023: the CTE C750 Air computer case, which uses the new CTE (centralized thermal efficiency) form factor. Its peculiarity lies in the fact that the motherboard is located at an angle of 90 degrees, and the motherboard tray itself is shifted to the center of the case, which expands the possibilities for ensuring efficient cooling of the components.
Image source: Thermaltake
The company emphasizes that there is no need to develop a new motherboard standard for the CTE form factor. Case models with horizontal installation of motherboards, i.e. when the external connectors of the card face the top of the case, have been on the market for a long time. In turn, the location of the motherboard in the center of the case allows for additional cooling fans to be installed in front, below and at the back of the case, creating positive air pressure inside.
The CTE C750 Air model is an example of a large and spacious case, where the motherboard tray located in the center also offers the possibility to install up to four 360 and even 420 mm liquid system radiators. The specific case model has two additional 120mm slots on the top panel. Thus, the novelty supports the installation of 14 cooling fans.
The CTE C700 Air case model has a shallower depth, which is why it lacks a side row of fan slots and instead offers the installation of 120mm “turntables” in front and behind. Additionally, two 120mm fans can be mounted at the bottom and another at the top.
The most compact models of Thermaltake cases of the new form factor are CTE C700 TG and CTE C500 TG. However, they also offer front and rear fan mounting.
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