Jakarta (ANTARA) – Taiwan Semiconductor Manufacturing Co. (TSMC) in the TSMC 2022 Technology Symposium event revealed that it will release a 3 nanometer chipset in 2023.
The plan coincides with the disclosure of TSMC’s roadmap for the next few years, including the development of a 2 nanometer chipset.
Citing Gizmochina, Sunday, there will be five 3 nanometer chips released with each named N3E, N3P, N3S, and N3X.
Also read: TMC unveils new advanced processor for cars
The N3 variant is claimed to offer a better process window, higher performance, increased transistor density and increased voltage for very high performance applications.
All of these technologies will feature TSMC’s innovative FINFLEX architecture that offers chip designers great flexibility and enables them to precisely optimize Chip performance, power consumption and cost.
N3 is built and developed for brands like Apple to take advantage of the performance, power, and area (PPA) improvements that leading nodes deliver.
If we talk about 2nanometer technology, It will offer a tremendous improvement over the N3, with a 10-15 percent increase in speed at the same power, or a 25-30 percent reduction in power at the same speed, setting a new standard for more efficient performance.
The first N3 chips are expected to go into production in the coming months and will hit the market in the first quarter of 2023 while the 2 nanometer chips are slated to go into production in 2025.
Also read: Apple continues to use TSMC’s A16 Bionic chip for iPhone 14
Also read: India reportedly exploring the possibility of building a semiconductor factory
Also read: Phones with Snapdragon 8 gen 1+ chipset rumored to be released in June 2022
Translator: Livia Kristianti
Editor: Alviansyah Pasaribu
COPYRIGHT © ANTARA 2022
–
