The photo of the presentation slide in September took the form of three versions of Intel’s new box coolers. Because from a generation Ivy Bridge Intel is increasing the real consumption of processors, but the coolers remain the same (so the noise increases), redesigning the cooling design seemed like a good idea. From the pictures, it looked as if the current low ribs were supplemented by higher ribs, which would increase the area for transferring heat from the passive part to the flowing air.
But the higher-resolution images published by leaker momomo_us and VideoCardz editors reveal something else. The high ribs are semi-transparent, therefore plastic, which means that they only have an aesthetic effect – they definitely do not dissipate heat.
This in itself does not necessarily mean that the cooling capacity will not increase. Just not as fundamentally as the September images could evoke. Intel is expected to ship these models in the box packaging of those models Alder Lake, which will be released in the first half of this year, lack the name “K” (ie about 65W basic TDP) or contain “T” (35W basic TDP). The heatsink in the small picture on the left should serve the Core i9 (12900?), In the middle the Core i3 / i5 / i7, and on the right the Celerons and Penties.
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